RFID標(biāo)簽封裝設(shè)備熱壓模塊的設(shè)計(jì)與實(shí)現(xiàn).pdf

1、華中科技大學(xué)碩士學(xué)位論文RFID標(biāo)簽封裝設(shè)備熱壓模塊的設(shè)計(jì)與實(shí)現(xiàn)姓名：金濤申請學(xué)位級別：碩士專業(yè)：機(jī)械電子工程指導(dǎo)教師：熊有倫黃永安20110115華中科技大學(xué)碩士學(xué)位論文華中科技大學(xué)碩士學(xué)位論文IIAbstractAtpresenttheapplicationoftheradiofrequencyidentificationtechnologyisusedwidelythedemofRFIDtagsisgrowingrapidlyth

2、erefeitisverysignificanttodotheresearchdevelopmentofRFIDtagpackageequipments.AsanespecialpackagewayofRFIDStrappackagehasmanyadvantagesrepresentsadevelopmenttendency.ThispapermainlystateshowtodesignthehotpressingmoduleofS

3、trappackageequipmentwhichisbasedonACApackagingtechnologyfocusingondesignofthehotpressingbonderwhichisthekeycomponentsofhotpressingmodule.Firstlythedesignrequirementofhotpressingmoduleiscreatedaccdingtothedesignfigureofth

4、eequipmentthetimerouteofhotpressingmoduleareplannedaccdingtoantennadistributionofStrapsubstrate.Thenaninitialplanofhotpressingmoduleiscreated.Secondlythecontrolschemeofthehotpressingbonderisdesignedaccdingtotherequiremen

5、tofthermalpressureprecisecontroltheyareverifiedthroughtheexperiment.Thirdlythefiniteelementmodelofthethermocompressionbonderiscreatedthestructureofhotpressingbonderisoptimizedaccdingtotheanalysisresult.Anexcellenthotpres

6、singbonderiscreatedafteraseriesofimprovements.Theresultsofthefiniteelementanalysisareverifiedbythethermalexperiment.Throughtheactualpackageexperimentthedesignedbonderhasreachedthedesignrequirementswhichareproposedinthisp