倒裝芯片物理設(shè)計的應(yīng)用技術(shù)研究.pdf

1、目錄摘要1Abstract2第一章封裝技術(shù)簡介4第一節(jié)封裝技術(shù)的發(fā)展4第二節(jié)倒裝芯片封裝技術(shù)6第二章倒裝芯片設(shè)計規(guī)則8第一節(jié)重布線層定義8第二節(jié)焊點下金屬設(shè)計規(guī)則8第三節(jié)凸點的類型10第四節(jié)凸點最大承載電流11第五節(jié)重布線層設(shè)計規(guī)則12第六節(jié)通孔設(shè)計規(guī)則13第七節(jié)凸點到芯片邊界規(guī)則14第八節(jié)角落凸點規(guī)則14第三章倒裝芯片自動化設(shè)計方法16第一節(jié)前期數(shù)據(jù)準備16第二節(jié)建立環(huán)境2l第三節(jié)凸點陣列生成q4第四節(jié)凸點到端口連接30第五節(jié)重布線層

2、走線41第六節(jié)電源地布線42第七節(jié)設(shè)計規(guī)則檢查與驗證48第八節(jié)流程總結(jié)一“49第四章協(xié)同設(shè)計50第一節(jié)布局設(shè)計50第二節(jié)數(shù)據(jù)交換53第五章總結(jié)56參考文獻67致謝58Abstract、()w“dfi：iysmo：l’eJnd130：1’eelectronicproducIs￡ll‘emovinginsma】1polltable，networkorienteddiFeelion，buttllemejntrendsinelectrflnic

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