ipc-a-600g印刷電路板驗(yàn)收規(guī)范

1、科技有限公司page1of82IPCA600RevisionEAcceptablilityofPrintedBoards印刷電路板檢驗(yàn)規(guī)范批準(zhǔn)：審核：編制日期：2007.2.22科技有限公司page3of822.5HolesPlatedThroughGeneral鍍通孔概要鍍通孔概要..............................................................................

2、................................32.5.1NodulesBurrs.鍍瘤毛頭.....................................................................................................................................................................

3、...................32.5.2PinkRing粉紅圈........................................................................................................................................................................................

4、.............32.5.3VoidsCopperPlating鍍銅層破洞...........................................................................................................................................................................32.5.4V

5、oidsFinishedCoating完工皮膜之鍍層破洞.......................................................................................................................................................32.5.5.1LiftedLs(Visual).................

6、...........................................................................................................................................................................32.6HolesUnsuppted未鍍孔未鍍孔.........................

7、.................................................................................................................32.6.1Haloing白圈............................................................................................

8、................................................................................................................32.7PrintedContacts板邊接觸金手指板邊接觸金手指...........................................................................

9、..................................................32.7.1SurfacePlatingGeneral表面鍍層通則.........................................................................................................................................

10、..........................32.7.1.1SurfacePlatingWireBondPads打線承墊之表面..............................................................................................................................................32.7.2Burrs

11、onEdgeBoardContacts板邊接點(diǎn)之毛頭...................................................................................................................................................32.7.3AdhesionofOverplate表面鍍層的附著力..............

12、...............................................................................................................................................32.8Marking標(biāo)記標(biāo)記..............................................................

13、..................................................................................................32.8.1EtchedMarking蝕刻標(biāo)記...................................................................................................

14、....................................................................................32.8.2ScreenedInkStampedMarking網(wǎng)印或蓋印標(biāo)記..................................................................................................

15、............................................32.9SolderResist（SolderMask）防焊綠漆）防焊綠漆......................................................................................................................32.9.1CoverageOverCon

16、ducts(SkipCoverage)邊線表面之覆蓋性（覆蓋不全、跳?。?.......................................................................................32.9.2RegistrationtoHoles(AllFinishes)對(duì)孔的套準(zhǔn)度（各種表處理層）............................................

17、......................................................................32.9.3RegistrationtoOtherConductivePatterns其它焊墊的對(duì)準(zhǔn)度...................................................................................................

18、...........................32.9.3.1BallGridArray(SolderResistDefinedLs)球腳格列體之焊墊（綠漆設(shè)限之焊墊）................................................................................32.9.3.2BallGridArray(CopperDefinedLs)球腳格列體（銅面設(shè)限之焊墊）

19、.....................................................................................................32.9.3.3BallGridArray(SolderDam)球腳格列體防焊堤...............................................................................

20、................................................................32.9.4BlistersDelamination起泡分層..............................................................................................................................

21、..............................................32.9.5Adhesion(FlakingPeeling)附著力(破片或剝落)......................................................................................................................................

22、........32.9.6WeaveWrinklesRipples波浪起皺紋路.............................................................................................................................................................32.9.7Tenting(ViaHoles)

23、蓋孔（導(dǎo)通孔、過(guò)孔）...........................................................................................................................................................32.9.8SodaStrawing吸管式綠漆浮空..............................

24、................................................................................................................................................32.10PatternDefinitionDimensional圖形尺寸特性圖形尺寸特性...............................

25、..........................................................................32.10.1ConductWidthSpacing線寬與間距...................................................................................................................

26、.......................................32.10.1.1ConductWidth線寬..............................................................................................................................................................

27、..........................32.10.1.2ConductSpacing導(dǎo)線間距.......................................................................................................................................................................