線路板pcb專(zhuān)業(yè)英語(yǔ)詞匯(制造、測(cè)試、缺陷名等)

1、PCBPCB英語(yǔ)詞匯英語(yǔ)詞匯(一）一）1.1.綜合詞匯綜合詞匯Printedcircuit印制電路Printedwiring印制線路Printedcircuitboard印制電路板Printedwiringboard印制線路板Printedcomponent印制元件Printedcontact印制接點(diǎn)Singlesidedprintedcircuitboard(SSB)單面印制電路板doublesidedprintedcircuitbo

2、ard(SSB)雙面印制電路板Multilayerprintedcircuitboard(MLB)多層印制電路板Rigidprintedcircuitboard剛性印制電路板Flexibleprintedcircuitboard撓性印制電路板Flexrigidprintedcircuitboard撓性印制電路板Buildupprintedboard積層印制板Surfacelaminarcircuit(SLC)表面層合電路板B2itpri

3、ntdboard埋入凸塊互連印制板ALIVHMultilayerprintdboard層間全內(nèi)導(dǎo)通多層印制板Chiponboard(COB)載芯片板Backplane背板Bareboard裸板Breakawayboard可斷拼板Interconnection互連Conductraceline導(dǎo)線Substrate基底R(shí)ealestate基板面Conductside導(dǎo)線面Componentside元件面Solderside焊接面Print

4、ing印制grid網(wǎng)格pattern圖形Conductivepattern導(dǎo)電圖形Nonconductivepattern非導(dǎo)電圖形Legend字符Mark標(biāo)志2基材基材2.12.1基材的種類(lèi)和結(jié)構(gòu)基材的種類(lèi)和結(jié)構(gòu)Basematerial基材Laminate層壓板Coppercladlaminate(CCL)覆銅箔層壓板Prepreg預(yù)浸材料Bondingsheetbondinglayer粘結(jié)片Epoxyglasssubstrate環(huán)氧

5、玻璃基板Coppercladsurface銅箔面Foilremovalsurface去銅箔面Lengthwisedirection縱向crosswisedirection橫向Cematerial內(nèi)層芯材2.22.2基材的材料基材的材料AstageresinA階樹(shù)脂BstageresinB階樹(shù)脂CstageresinC階樹(shù)脂epoxyresin環(huán)氧樹(shù)脂Polymer聚合物Photosensitiveresin感光性樹(shù)脂Thermosett

6、ingresin熱固性樹(shù)脂Thermoplasticresin熱塑性樹(shù)脂Adhensive膠粘劑Curingagent固化劑Flameretardant阻燃劑opaquer遮光劑Polyesterfilm(PET)聚酯薄膜Polyiefilm(PI)聚酰亞胺薄膜Polytetrafluoetylene(PTFE)聚四氟乙烯Nonwovenfabric非織布無(wú)紡布Glassfiber玻璃纖維Glassfabric玻璃布3設(shè)計(jì)設(shè)計(jì)3.13.

7、1通用術(shù)語(yǔ)通用術(shù)語(yǔ)Computeraideddesign(CAD)計(jì)算機(jī)輔助設(shè)計(jì)Computeraidedmanufacturing(CAM)計(jì)算機(jī)輔助制造Routing布線Layout布圖設(shè)計(jì)Componentdensity元件密度Arry陣列3.23.2形狀與尺寸形狀與尺寸Conduct導(dǎo)線Conductwidth導(dǎo)線寬度Conductspacing導(dǎo)線間距Conductwidthspace導(dǎo)線寬度間距Conductlayer導(dǎo)線層

8、Componenthole元件孔Mountinghole安裝孔Supptedhole支撐孔Unsupptedhole非支撐孔Via導(dǎo)通孔Platedthroughhole鍍通孔Blindvia(hole)盲孔Buriedvia(hole)埋孔Buriedblindvia埋盲孔Anylayerinnerviahole(ALIVH)任意層內(nèi)部導(dǎo)通孔Toolingpilothole定位孔Llesshole無(wú)連接盤(pán)導(dǎo)通孔Viainpad在連接盤(pán)

9、中導(dǎo)通孔Pitch節(jié)距Finepitch精細(xì)節(jié)距3.33.3電氣互連電氣互連Interfacialconnection表面間連接Interlayerconnection層間連接Innerlayerconnection內(nèi)層連接Padl連接盤(pán)Componentlead3.43.4其他其他Primaryside主面Secondaryside輔面Signallayer信號(hào)層Crosstalk串?dāng)_Capacitance電容Electromagic

10、interference(EMT)電磁干擾Electromagicshielding電磁屏蔽Impedance特性阻抗Inductance電感Coplanarity共面性（度）Cematerial芯板Thintypemultilayerboard薄型多層板Buriedblindviaholemutilayerboard埋盲孔多層板Buriedbumpinterconnectiontechnology(B2it)嵌入凸塊互連技術(shù)Multi