線路板常用術(shù)語中英文對照(1

1、一、綜合詞匯1、印制電路：printedcircuit2、印制線路：printedwiring3、印制板：printedboard4、印制板電路：printedcircuitboard(pcb)5、印制線路板：printedwiringboard(pwb)6、印制元件：printedcomponent7、印制接點：printedcontact8、印制板裝配：printedboardassembly9、板：board10、單面印制板：si

2、nglesidedprintedboard(ssb)11、雙面印制板：doublesidedprintedboard(dsb)12、多層印制板：mulitlayerprintedboard(mlb)13、多層印制電路板：mulitlayerprintedcircuitboard14、多層印制線路板：mulitlayerpritedwiringboard15、剛性印制板：rigidprintedboard16、剛性單面印制板：rigids

3、inglesidedprintedbad17、剛性雙面印制板：rigiddoublesidedprintedbad18、剛性多層印制板：rigidmultilayerprintedboard19、撓性多層印制板：flexiblemultilayerprintedboard20、撓性印制板：flexibleprintedboard21、撓性單面印制板：flexiblesinglesidedprintedboard22、撓性雙面印制板：fl

4、exibledoublesidedprintedboard23、撓性印制電路：flexibleprintedcircuit(fpc)24、撓性印制線路：flexibleprintedwiring25、剛性印制板：flexrigidprintedboardrigidflexprintedboard26、剛性雙面印制板：flexrigiddoublesidedprintedboardrigidflexdoublesidedprinted27

5、、剛性多層印制板：flexrigidmultilayerprintedboardrigidflexmultilayerprintedboard28、齊平印制板：flushprintedboard29、金屬芯印制板：metalceprintedboard30、金屬基印制板：metalbaseprintedboard31、多重布線印制板：mulitwiringprintedboard32、陶瓷印制板：ceramicsubstrateprin

6、tedboard33、導電膠印制板：electroconductivepasteprintedboard34、模塑電路板：moldedcircuitboard35、模壓印制板：stampedprintedwiringboard36、順序?qū)訅憾鄬佑≈瓢澹簊equentiallylaminatedmulitlayer37、散線印制板：discretewiringboard38、微線印制板：microwireboard39、積層印制板：bui

7、leupprintedboard40、積層多層印制板：buildupmulitlayerprintedboard(bum)41、積層撓印制板：buildupflexibleprintedboard42、表面層合電路板：surfacelaminarcircuit(slc)43、埋入凸塊連印制板：b2itprintedboard44、多層膜基板：multilayeredfilmsubstrate(mfs)9、金屬芯覆銅箔層壓板：metalc

8、ecoppercladlaminate10、金屬基覆銅層壓板：metalbasecoppercladlaminate11、撓性覆銅箔絕緣薄膜：flexiblecoppercladdielectricfilm12、基體材料：basismaterial13、預浸材料：prepreg14、粘結(jié)片：bondingsheet15、預浸粘結(jié)片：preimpregnatedbondingsheer16、環(huán)氧玻璃基板：epoxyglasssubstra

9、te17、加成法用層壓板：laminatefadditiveprocess18、預制內(nèi)層覆箔板：masslaminationpanel19、內(nèi)層芯板：cematerial20、催化板材：catalyzedboardcoatedcatalyzedlaminate21、涂膠催化層壓板：adhesivecoatedcatalyzedlaminate22、涂膠無催層壓板：adhesivecoateduncatalyzedlaminate23、粘

10、結(jié)層：bondinglayer24、粘結(jié)膜：filmadhesive25、涂膠粘劑絕緣薄膜：adhesivecoateddielectricfilm26、無支撐膠粘劑膜：unsupptedadhesivefilm27、覆蓋層：coverlayer(coverlay)28、增強板材：stiffenermaterial29、銅箔面：coppercladsurface30、去銅箔面：foilremovalsurface31、層壓板面：uncl

11、adlaminatesurface32、基膜面：basefilmsurface33、膠粘劑面：adhesivefaec34、原始光潔面：platefinish35、粗面：mattfinish36、縱向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛紙質(zhì)覆銅箔板：phenoliccellulosepapercoppercladlaminates(p

12、henolicpaperccl)40、環(huán)氧紙質(zhì)覆銅箔板：epoxidecellulosepapercoppercladlaminates(epoxypaperccl)41、環(huán)氧玻璃布基覆銅箔板：epoxidewovenglassfabriccoppercladlaminates42、環(huán)氧玻璃布紙復合覆銅箔板：epoxidecellulosepaperceglassclothsurfacescoppercladlaminates43、環(huán)氧

13、玻璃布玻璃纖維復合覆銅箔板：epoxidenonwovenwovenglassreinfcedcoppercladlaminates44、聚酯玻璃布覆銅箔板：ployesterwovenglassfabriccoppercladlaminates45、聚酰亞胺玻璃布覆銅箔板：polyiewovenglassfabriccoppercladlaminates46、雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleietriazineepo

14、xidewovenglassfabriccoppercladlamimates47、環(huán)氧合成纖維布覆銅箔板：epoxidesyntheticfiberfabriccoppercladlaminates48、聚四乙烯玻璃纖維覆銅箔板：teflonfiberglasscoppercladlaminates49、超薄型層壓板：ultrathinlaminate50、陶瓷基覆銅箔板：ceramicsbasecoppercladlaminates